国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08K（14）
IPC C08K003/04（14）
发明人 TANG B（4） TANG F（4）
公开年 2015（14）
申请年 2015（10）  2014（4） 
专利权人 TONGLING SHE.（4）

Low-temperature resistant thermally-conductive fluorine rubber material comprises fluorine rubber, ethylene-propylene rubber, fumed silica, kaolin nanoparticles, modified graphene, microencapsulated red phosphorus and dioctyl sebacate.

CHEN X

High-dielectric polyimide composite film for load capacitor, contains vanadium pentoxide, expanded graphite, pyromellitic dianhydride, graphene, ethanol, hydroxyethyl methacrylate, polyvinyl alcohol, water and boric acid solution.

TANG B, TANG F

Capacitor with mixed microcrystalline glass powder loaded graphene comprises polyimide high dielectric composite film including polyacrylonitrile based carbon fiber powder, pyromellitic dianhydride, and 4,4-bis diaminodiphenyl ether.

TANG B, TANG F

High-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material useful for light-emitting diode packaging, comprises e.g. phenyltrimethoxysilane, divinyltetramethyldisiloxane, silica and graphene.

ZHU Z

Graphene oxide-iron oxide based composite electric conduction rubber comprises conductive filler, graphene oxide and iron oxide, and is prepared by dispersing grapheme oxide in deionized water.

DAI L, LAN J, WU Y

High dielectric composite film used for capacitor, comprises graphene oxide sol, pyromellitic dianhydride, 4,4'-diaminodiphenyl ether, nano-molybdenum disulfide, N-vinylpyrrolidone, N, N- dimethylacetamide and ethanol.

TANG B, TANG F

Dielectric composite film comprises pyromellitic dianhydride, 4,4-diaminodiphenyl ether, N-vinylpyrrolidone, N, N-dimethyl acetamide, nano boron carbide, graphene, ethanol, silane coupling agent and hydroxyethyl methacrylate.

TANG B, TANG F

LED light source PTFE irradiation aging heat dissipating material includes sodium silicate, nano-cerium oxide, silica sol, graphene oxide, potassium aluminum sulfate, room temperature non-foaming surfactant, water and polyether ether ketone.

XIAO J, ZHANG C, ZHENG Y

Organic-inorganic composite thermally conductive filler used for e.g. thermally conductive thermoplastic resin comprises graphene oxide, hyperbranched polymer, coupling agent, and phenolic resin-coated thermally conductive inorganic filler.

CAO H, YUE L, YAN Y

Preparation of graphene/polyamide dielectric composite material includes mixing sebacic acid, itaconic acid, decamethylenediamine and diamine monomer, drying under vacuum, taking carbon nanosphere and dispersing.

JIA Q, ZHANG Y, ZHANG H