国家/地区 中国（80） 世界知识产权组织（8） 韩国（6） 美国（4） 日本（3） 台湾（2）
IPC部 C（88）
IPC大类 C08（88）
IPC小类 C08L（88）
IPC C08L063/00（88）
发明人 LI W（8） GUO Y（5） LIU L（5）
CAI X（4） CHEN Y（4） LI J（4）
LIU Y（4） LI H（3） LI Q（3）
PAN Z（3） QIU S（3） SUN R（3）
WEI X（3） XIAO J（3） ZHANG H（3）
公开年 2018（17） 2022（15） 2017（14） 2021（14） 2020（8） 2023（5） 2015（3） 2016（3） 2019（3） 2013（2） 2014（2）
申请年 2017（14）  2020（14）  2022（12）  2018（11）  2016（9）  2019（9）  2021（7）  2014（3）  2011（2）  2012（2）  2013（2）  2015（2） 
专利权人 ANHUI AEROSP.（3） CHINESE ACAD.（3） SHENZHEN INS.（3） UNIV SHANGHA.（3）
GUANGDONG MO.（2） HANSOL CHEM .（2） NINGBO INST .（2） SAMSUNG ELEC.（2）
TONGLING TON.（2） UNIV FUDAN（2） UNIV QILU TE.（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparing epoxy resin composite thermal conducting sheet useful in the technical field of functional sheet materials, comprises e.g. mixing the fluorinated graphene thermal conducting film, phthalic anhydride and ether, coating the mixed slurry and peeling off epoxy resin composite material layer.

PAN Z, ZHOU M