国家/地区 中国（115）
IPC部 C（115）
IPC大类 C08（115）
IPC小类 C08L（115） C08K（110） C08J（53）
B32B（14） D06M（11） C08G（10）
B29C（8） C09K（8） H05K（8）
C09D（6） C01B（5） A43B（3）
B01D（2） B29B（2） B33Y（2）
IPC C08L063/00（115）
发明人 LIU Y（8） WANG Y（7） ZHANG X（7）
WANG X（6） CHEN Y（5） LI Y（5）
WANG Z（5） ZHANG Z（5） HE H（4）
LI B（4） LI P（4） LIANG M（4）
PAN Z（4） WANG Q（4） WANG S（4）
公开年 2022（77） 2023（38）
申请年 2022（115）
专利权人 HUIZHOU ZHON.（4） LANZHOU CHEM.（4） ANHUI AEROSP.（3） HARBIN INST .（3）
UNIV SICHUAN（3） CHANGSHU SHE.（2） JIANGSU HEHE.（2） JIANGSU YAO .（2）
SHENGYI TECH.（2） UNIV CHINA E.（2） UNIV ZHEJIAN.（2） XINRUN NEW M.（2）

Polyamideimide composite material useful for sealing valve body, comprises silicon dioxide/polyamide-imide composite material, epoxy resin, carbon fiber, acetone, dibutyl phthalate, graphene, vulcanizing agent, accelerators, and anti-aging agent.

TAO F, ZHU J

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Preparing medicine packaging composite film with super peel strength used in medicine industry, by adding high-pressure polyethylene and linear low-density polyethylene in mixer, carrying out high-speed mixing, screw extrusion molding, cooling, modifying and ultrasonically processing.

SUN E, SUN Z, LI W, SHI S, ZHANG L

Preparing blue light scattering plate useful in Rayleigh scattering solar lamp system, comprises mixing dispersion liquid precursor with inorganic submicron particles in polymer emulsion to obtain dispersion and mixing dispersion precursor-polymer emulsion to obtain dispersion and preparing both.

HUANG X, HUANG W

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing thin-layer graphene polymer composite material comprises e.g. mixing and compacting e.g. polyvinyl alcohol, polyvinyl azide, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, triallyl isocyanurate, epoxy resin, modified graphene, and 4,4'-diaminobiphenyl.

WANG Z

Wave-absorbing component, obtained by mixing and curing graphene powder and thermal epoxy resin.

YU J, MA T, LU Q, ZHANG Y

Modified graphene-based epoxy resin composite material useful in electronic device, comprises epoxy resin, modified graphene, modified silicon carbide, curing agent and accelerator.

LIN H, DI H, SUN J, SONG Y, XIAO Q