国家/地区 日本（31）
IPC部 C（31） B（16） D（15）
H（15） F（3）
IPC大类 C08（31）
IPC小类 C08K（31） C08L（30） D01F（13）
C01B（10） C09D（10） H05K（9）
B32B（8） B29C（7） C08J（7）
H01B（6） H01L（6） C08F（4）
B01J（3） C08G（3） C09C（3）
IPC C08K007/06（31）
发明人 HARA H（6） SANO H（3） TAKAGI S（3）
YANAGISAWA T（3） ARAI Y（2） DOI S（2）
ENDO M（2） KIM Y S（2） KISHIMOTO H（2）
SHIMANAKA H（2） TADOKORO H（2）
公开年 2009（6） 2021（6） 2004（3） 2022（3） 2002（2） 2014（2） 2017（2） 2018（2）
申请年 2007（6）  2021（5）  2002（4）  2013（2）  2017（2）  2019（2）  2022（2） 
专利权人 TEIJIN LTD（6） ACHILLES COR.（2） DAINICHISEIK.（2） ENDO M（2）
GSI CREOS CO.（2） NIPPON GRAPH.（2）

Carbon material dispersion liquid used for forming coating material, comprises carbon black, carbon fiber, graphite, graphene, water, and polymer dispersant comprising polymer block with structural units derived from acrylonitrile and methacrylic acid.

SHIMANAKA H, MURAKAMI K, DOI S, SHIMOOKA R, UMEDA D, KANEKO S, GOTO J

Conductive polymer composition used for forming film, comprises polythiophene containing at least two structural units and carbon material.

KUDO K, KAWAKAMI J, SENNO Y

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Thermoplastic resin composition for manufacturing conductive member, is obtained by melt-kneading at least thermoplastic resin, carbon nanostructure, and graphene or carbon black having specific Brunauer-Emmett-Teller (BET) specific surface area.

YUKI K, TOMOHIRO M, MONMA T, KANDA Y

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Milled pitch-based carbon fiber used for forming heat conductive molded article, comprises anisotropic pitch as raw material, where graphene sheet is open when observing fiber end face with transmission electron microscope.

KISHIMOTO H, ARAI Y, TADOKORO H

Preparing directional heat conducting sheet used for semiconductor radiating device, by placing fluid composition in orientation forming device, applying high-speed shear force, orienting filler in composition in shear direction to form thin-layer composition, collecting in mold, curing and slicing.

REN Z, WANG H, REN Z M

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E