国家/地区 中国（21）
IPC部 B（21）
IPC大类 B32（21） C08（21） B29（4）
D06（3） H05（3）
IPC小类 B32B（21）
IPC C08J005/24（21）
发明人 WANG B（3） WANG F（3） CHEN J（2）
HE H（2） LI Y（2） LIU H（2）
LIU Y（2） ZHANG Y（2） ZHANG Z（2）
ZHOU L（2）
公开年 2022（8） 2021（7） 2014（2） 2023（2）
申请年 2022（9）  2020（4）  2021（3） 
专利权人 HUIZHOU ZHON.（2） UNIV QILU TE.（2）

Nano-filler reinforcing fiber hybrid structure ballistic resistant composite material formed by paving first prepreg (nano filler modified fiber prepreg) obtained by soaking reinforcing fiber in modified aqueous polyurethane and second prepreg (weft-free cloth) obtained by soaking reinforcing fiber.

QI C, SONG L, SHANG B, ZHAO Y, GUO M

Manufacture of graphene nanosheet modified carbon fiber composite material used for e.g. aerospace, involves spreading graphene dispersion liquid containing polymer electrolyte on carbon fiber cloth surface, laying cloth alternately, impregnating resin glue into preform, heating and solidifying.

YAO J, LIU Q, WANG B, LIU H, ZHOU L, WANG F

Inorganic fiber film/micro-nano hollow particle composite material useful for preparing lightning protection product comprises mixture composed of high temperature resistant resin, curing agent and micro-nano hollow particles and inorganic fiber film framework.

ZHANG Z, ZHANG H, GAO F, ZHU M, BAI Y

Preparing X-band stealth/lightning protection skin comprises laying up carbon fiber prepreg, conductive prepreg, wave-absorbing prepreg and wave-transmitting prepreg in sequence on surface of tooling, obtaining first skin, and molding first skin by vacuum bag process.

LI B, SONG Z, WEN Y, LIU Y

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Preparing modified continuous carbon fiber reinforced Polyetheretherketone composite material laminated plate useful in sporting goods, comprises treating surface of continuous carbon fiber, preparing unidirectional prepreg tape by melt impregnation method and mold pressing.

WANG T, WANG J, PAN T, GUO P

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Producing textured composite board mobile phone cover, comprises mixing epoxy resin, allyl-containing epoxy monomer and curing agent to obtain a glue solution, coating glue on sides of modified glass fiber cloth, curing to form prepreg, placing textured film on upper surface, and hot pressing.

CHEN H, CHEN J, WANG B, HE H, ZHANG Z

Graphene/SiCnw composite film modified carbon fiber composite material comprises composite preform impregnated with liquid resin and cured to obtain composite material.

ZHOU L, WANG B, ZHANG Y, WANG F