国家/地区 中国（10）
IPC部 B（10）
IPC大类 B32（10） C09（10） H05（3）
B27（2） H01（2）
IPC小类 B32B（10）
IPC C09J011/04（10）
发明人
公开年 2022（10）
申请年 2022（7）  2021（2） 
专利权人

Super-soft elastic composite material used in disposable absorbent products, comprises substrate layer with pleated structure, and multiple elastic bodies that are arranged at intervals on substrate layer along widthwise direction of substrate layer.

YANG Q

Producing resin-based ceramic composite copper clad plate comprises e.g. adding modified hexagonal boron nitride powder into graphene oxide solution, mixing epoxy resin and carboxy-terminated nitrile rubber, coating glue on surface of aluminum plate, and laminating copper foil on glue layer surface.

SONG S

Black adhesive useful in preparation of first adhesive layer for aluminum-plastic film, comprises reduced graphene oxide, polydopamine, polyurethane resin and solvent e.g. ethyl acetate, toluene or xylene.

LIN J, YU X, WANG H, SONG Y, LI X

Antibacterial enhanced decorative veneer plywood comprises polyethylene terephthalate (PET) decorative film, particle layer, plywood layer made of plywood and shavings, particle layer, PET decorative film, PET decorative film, particle layer, plywood layer and modified resin adhesive.

CAI G, WEI R, ZHAN J, LU L, YUAN Z

Preparing eco-friendly moisture-proof solid wood board, involves taking formaldehyde, stirring sodium hydroxide, adding urea and modified melamine, adjusting pH of formic acid solution, adding acylated tannin and adding ammonium chloride and uniformly stirring to obtain adhesive.

ZHANG H, PAN X

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

High thermal conductivity high frequency flexible copper clad laminate for flexible printing circuit board, has adhesive layer obtained by drying glue, where glue comprises e.g. inorganic filler, rubber, resin, curing agent, and dispersant.

WANG Q, ZHANG B, WU T, GENG J, ZHUO F, GENG G, WU Y

Preparing high heat-conducting copper-clad plate useful in electronic device, comprises e.g. polishing and coarsening each plane of copper and aluminum plate, coating obtained heat conducting colloid, bonding copper plate to obtain composite plate with three-layer sandwich structure and drying.

CHE Y, FU C, WANG X

Lithium-ion pouch cell-corrosion aluminum plastic film comprises heat-sealing layer, first functional layer, aluminum foil layer, second functional layer, and protective layer, first and second functional layers includes modified polyurethane and self-repairing micro-capsule.

LI G, CUI R

Aging-resistant packaging bag comprises a poly(ethyl benzene-1,4-dicarboxylate) alumina layer, first adhesive layer, nylon film layer, second adhesive layer and polyethylene layer.

HUANG Y