国家/地区 中国（23）
IPC部 C（23） H（2）
IPC大类 C08（23） C09（5） H01（2）
IPC小类 C08G（23）
IPC C08L079/08（23）
发明人 LIU G（3） XU Z（3） JIN W（2）
LIU H（2） ZHANG Q（2） ZHAO Y（2）
公开年 2021（23）
申请年 2021（14）  2020（7） 
专利权人 ZHEJIANG ZHO.（4）

Inorganic/organic inter-doped hydrophobic polyimide aerogel composite material used e.g. for heat insulation field comprises polyimide organic gel system and cobalt iron oxide inorganic gel system bridged by modified carbon quantum dots.

XIONG L, ZHENG Y

Preparing polyimide/graphene composite film used in in OLED display, involves performing ultrasonic reaction to the graphene oxide and thionyl chloride to obtain the acyl chloride graphene.

JIN W, LIU G, HU T

Solvent-free synthetic material for ice and snow motion, comprises isocyanate prepolymer, hydroxyl alkyd resin, low temperature resistant polyester polyol, trifluoroethanol, hexafluoro butyl alcohol, and secondary amino compound.

CHEN P, WANG G

Transparent polyimide composite conductive film comprises silver nanowire layer and graphene oxide layer attached to transparent polyimide base film surface.

JIN W, XU Z, QUE X

Graphene in-situ modified polyimide film is prepared by polycondensation of graphene grafted with aminosiloxane on the surface, diamine and dianhydride and forming into film.

XU Z, LIU G, ZHANG Q

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Corrosion-resistant PI thrust pad is made of polyimide composite and prepared by using graphene oxide and chitosan to react to prepare a carbon matrix composite and using toluene diisocyanate and pyromellitic anhydride.

JI Q

Preparing high-conductivity flexible polyimide composite film, involves adding graphene oxide aqueous dispersion to polyimide microsphere dispersion, adding reducing agent, reacting diamine and dianhydride in solvent, ultrasonically dispersing, casting to film, and performing thermal imidization.

FANG S, JIANG H, LI J, XU L, CHEN G

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Preparation of polyimide for polyimide sealing ring, involves mixing anthracene-2,6-diamine, graphene oxide and solvent, reacting, mixing with dianhydride monomer and diamine monomer, and performing imidization reaction.

DENG P, WEI W, SHI Y, ZHAO Y, PAN L