国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08L063/02（8）
发明人 LI J（2）
公开年 2023（3） 2022（2）
申请年 2022（3）  2021（2） 
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Preparing carbon-based composite filler useful for thermal interface material, comprises performing surface hydroxylation treatment on carbon films, soaking hydroxylated carbon film in saturated metal salt solution, taking out, drying to obtain metal salt-loaded carbon film, and heating.

ZHOU R

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S