国家/地区 世界知识产权组织（22）
IPC部 C（22）
IPC大类 C08（22） C09（22） H01（11）
C01（7） H05（7） B29（4）
C04（3） B82（2） F28（2）
IPC小类 C08L（22）
IPC C09K005/14（22）
发明人 DING J（2） LIN Y（2） MA J（2）
REN L（2） SUN R（2） XU J（2）
XU Y（2） YE Z（2） ZENG X（2）
ZHANG C（2） ZHANG Y（2）
公开年 2021（8） 2022（5） 2016（3） 2017（2） 2018（2）
申请年 2020（5）  2021（4）  2022（4）  2015（3）  2016（2）  2017（2） 
专利权人 FUJI POLYMER.（3） HUAWEI TECHN.（2） NINGBO INST .（2） SHENZHEN INS.（2）

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Flexible cellular foam product used for article e.g. mattress, comprises flexible foam substrate, and coating layer comprising highly thermally-conductive nanomaterial, and binder which is at least one chosen from, e.g. acrylic polymer emulsions and styrene-butadiene latex.

STOJANOVIC H, SCHERREY A N, CRAWFORD M L

Incorporation of carbon nanomaterials into polymeric matrix of composite that is adhered to metallic surfaces for protection against corrosion, involves producing reduced graphene oxide followed by sieving and incorporating into matrix.

DA SILVA MEDEIROS F, GOMIDE DE CASTRO V, GOULART SILVA G, SALOMAO RIBEIRO CURY C, MEDEIROS F D S, CASTRO V G D, SILVA G G, CURY C S R, DA SILVA M F, GOMIDE D C V, GOULART S G, SALOMAO R C C

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Preparation of graphite oriented thermal interface material involves mixing raw material components of graphite oriented thermal interface material, orienting, freezing, cutting, performing high temperature curing treatment and cutting.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R, ZHAGN Y