国家/地区 中国（7） 美国（3）
IPC部 C（10）
IPC大类 C25（10） H05（10） H01（2）
IPC小类 C25D（10）
IPC H05K003/42（10）
发明人 CAO X（3） MA Y（3） YE G（3）
ZHANG J（3） ZHENG K（3） YANG N（2）
YEH A（2）
公开年 2021（5） 2023（3）
申请年 2021（4）  2020（2）  2022（2） 
专利权人 CHINESE ACAD.（3） TRIALLIAN CO.（2） YEH A（2）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Graphene sheet/carbon black composite black hole liquid useful in printed circuit board, comprises graphene sheet, carbon black, surfactant, aqueous high molecular polymer, potassium hydroxide solution and deionized water.

WANG J, LI Z, CAO L, BAI J, FANG B, HAO L

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y

Conductive slurry for plating circuit board, comprises carbon material containing carbon nanotube and/or graphene, dispersant and binder, which are uniformly mixed in solvent.

CHIU C, HUANG C

Method for modifying walls and bottoms of holes with reduced graphene oxide, involves providing substrate with copper cladding layer and drilled holes, while modifying walls and bottoms of holes with reduced graphene oxide.

YEH A, YANG N, YEH D, YANG F