国家/地区 中国（60）
IPC部 C（60）
IPC大类 C25（60） C23（14） H05（13）
H01（8） C01（7） C09（6）
G01（6） D06（5） C22（4）
C04（3） B05（2） B22（2）
B82（2） C08（2） C30（2）
IPC小类 C25D（60）
IPC C25D005/54（60）
发明人 ZHANG J（7） MA Y（6） CAO X（5）
YE G（5） ZHENG K（5） WANG X（4）
WANG Y（4） CHEN Z（3） LU J（3）
MA X（3） ZHANG Y（3） CHEN P（2）
CHEN W（2） CHEN Y（2） FANG B（2）
公开年 2021（15） 2022（10） 2023（9） 2020（6） 2017（5） 2018（5） 2015（3） 2013（2） 2019（2）
申请年 2021（17）  2020（10）  2022（8）  2018（5）  2019（5）  2015（3）  2016（3）  2017（3）  2013（2） 
专利权人 CHINESE ACAD.（5） UNIV ZHEJIAN.（3） UNIV NANJING.（2）

Device for producing graphene-based copper-based nano copper film on circuit board of electronic product, has drainage component that is provided between solution tank and reaction tank for draining solution in solution tank into reaction tank.

PANG M, XIE B

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Preparing resin-based composite material filled with high heat-conducting three-dimensional framework foam useful in displaycard radiating, comprises e.g. copolymerizing three-dimensional framework foam after electro-deposition by resin system by liquid-phase vacuum dipping, solidifying and forming.

LI W, ZHAO Y, WU X, YAN K, XU K, SHI S, WANG Y, JIANG T

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Self-supporting flexible hydrogen peroxide sensor electrode material based on manganese oxide-cobalt/reduced graphene oxide-carbon nanotube, comprises three dimentional porous nano-flower-shaped manganese dioxide.

ZHANG Y, HONG X, LIU W, ZHAO J, MENG A, LI Z, SHENG L

Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.

MIAO H, ZHU K