国家/地区 中国（17） 韩国（2） 台湾（2） 美国（2） 世界知识产权组织（2）
IPC部 C（22）
IPC大类 C23（22）
IPC小类 C25D（22）
IPC C25D003/38（22）
发明人 KOHIKI M（3） SAKAGUCHI K（3） ZHANG Z（3）
GUO C（2） HE P（2） LAI H（2）
LI F（2） LI X（2） WANG X（2）
YANG D（2） ZHOU L（2）
公开年 2021（4） 2022（4） 2020（3） 2023（3） 2014（2） 2015（2） 2019（2）
申请年 2021（6）  2019（4）  2022（4）  2013（3） 
专利权人 NIPPON MININ.（3） CHINA DONGFA.（2） GUANGZHOU UL.（2）

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Method for forming copper-oxidation graphene laminated composite material for use in radiating field and electronic industry, involves forming copper-oxidation graphene laminated composite material with high thermal conductivity.

ZHAO B, YANG Q, ZHOU L, CAO J, WANG W, LI F, ZHAN K

Highly conductive graphene-pretreated electroplated metal fibers, comprises graphene oxide layer provided on outside of non-woven fabric, outside of metal nickel layer provided with electroplated copper layer, and protective nickel layer provided on outside of electroplated copper layer.

HU T, FANG R

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

Protective layer structure for chemical nickel plating of aviation electric appliance accessory, comprises aluminum alloy base body, and chemical zinc depositing layer, pre-plating copper layer, and graphene sealing layer.

XIA L, GUO C, LAI H