国家/地区 中国（18） 美国（2）
IPC部 C（20）
IPC大类 C23（20）
IPC小类 C23C（20）
IPC C23C014/35（5） C23C028/00（4） C23C028/02（4）
C25D003/56（4） C25D003/12（3） C25D003/38（3）
C25D007/06（3） B82Y030/00（2） B82Y040/00（2）
C08L023/12（2） C23C014/02（2） C23C014/16（2）
C23C014/18（2） C23C014/20（2） C23C014/24（2）
发明人 GUO C（3） LAI H（3） CHEN K（2）
LI X（2） WANG W（2） ZHAO W（2）
ZHU Z（2）
公开年 2023（20）
申请年 2022（14）  2023（4）  2020（2） 
专利权人 GUANGZHOU UL.（3）

Branched nano-wire array composite photoelectric film used for photo cathode protection, has composite heterojunction system cadmium sulfide/reduced graphene oxide quantum dots/titanium dioxide branched nanowire array composite photoelectric film.

HOU B, LU G, SUN M, JIANG X

Silver-graphene composite plating layer, has layer main body provided with first nano-silver layer, silver-graphene layer and second nano-silver layer that are sequentially arranged on base body.

LI H, ZHAO K, ZHANG Q, CHEN B, GUO W, ZHU Z, ZHANG C, DING Y, PANG Z

Preparation of magnesium alloy ultrasonic electrodeposition nano-nickel-based composite layer involves connecting magnesium alloy sample as negative electrode, and nickel plate as positive electrode respectively with pulse power supply, soaking in electroplating solution, and electrodepositing.

HU D, LI Z

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Improving tribological property of titanium substrate through electrophoretic deposition involves using titanium substrate that is pure titanium substrate, coating pure titanium substrate with graphene nanoplatelets at deposition parameters, and annealing, where pure titanium substrate is cathode.

MALLICK M, ARUNACHALAM N

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Method for preparing composite mask plate in electronic device processing field, involves setting photo-etching pattern on mask plate, removing part of photoresist, removing remaining photoresist with cleaning solution, cleaning laser opening residue, and drying mask plate to finish preparation.

CAI J, JIANG C, ZHUANG M, WU J, ZHAO W, YAO Q

Plating layer structure for preparing chromium-free black conversion film, comprises metal substrate, and zinc-iron alloy plating layer sequentially from inside to outside on metal substrate.

LAI H, GUO C, LI X