国家/地区 美国（28）
IPC部 B（28）
IPC大类 B32（28）
IPC小类 B32B（28） H05K（10） C08K（7）
H01L（7） H01M（6） C08L（5）
H05B（5） C01B（4） C08J（4）
C09D（4） C09J（3） F28F（3）
H01B（3） B05D（2） B29C（2）
IPC B32B009/00（8） B32B007/12（6） B32B009/04（6）
B32B027/08（6） B32B033/00（6） B32B027/20（5）
B32B015/04（4） B32B015/08（4） B32B027/00（4）
B32B027/18（4） B32B027/30（4） B32B027/32（4）
B32B027/36（4） H05K007/20（4） B32B003/08（3）
发明人 CHANG C（2）
公开年 2021（28）
申请年 2020（15）  2021（8）  2019（5） 
专利权人

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Laminated graphitic layer used as an elastic heat spreader, comprises graphitic films and/or graphene films comprising graphitic crystals or graphene planes, and conducting polymer network adhesive which bonds together graphitic or graphene films.

JANG B Z, WANG Y, ZHAMU A

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Use of composite material as electro-thermal film in manufacture of electrical heating panels.

LHOST O, TROLEZ Y, BOUKALIDIS C, MARCQ F

Tribological power generator for harvesting triboelectric electricity, comprises flexible electrode unit with metal layer provided between first and second dielectric layer and triboelectric charging is generated by contact and non-contact.

OH B, SHIN Y, CHO S, JUNG G, OH B S, SEOP S Y, JUNG G Y

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Electric motor for thermal management, comprises stator having stator slot and composite material within stator slot, composite material including matrix material and additive particles having thermal conductivity.

GILLIES J G, TRICKETT E C M, LAMBERT T N L

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R