国家/地区 台湾（15）
IPC部 C（15）
IPC大类 H05（15）
IPC小类 H05K（13） H01L（8） C01B（5）
C08K（4） C08L（4） C09J（4）
H01B（4） B32B（3） C09D（3）
C09K（3） B82Y（2） C08G（2）
C08J（2） H05H（2）
IPC H05K007/20（7） H01L023/373（5） H05K009/00（5）
C01B032/182（4） C08K003/04（4） C09J011/04（4）
C09J011/08（3） C09J133/08（3） C09J163/00（3）
C09J201/00（3） B32B009/00（2） B82Y040/00（2）
C01B032/20（2） C08L063/00（2） C09D005/32（2）
发明人 HE M（3） HUANG C（3） HUANG H（3）
ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3）
公开年 2022（15）
申请年 2021（13）  2022（2） 
专利权人 CTRON ADVANC.（3） LINTEC CORP（3）

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Upper electrode assembly used in plasma processing apparatus, has heat transfer sheet that is mounted between electrode plate and metal plate and having vertically oriented portion with vertically oriented graphene structures.

TSUJIMOTO H, KOBUNE T, LI L, LEE L, KOBUNEDAKAKI

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Preparing radionuclides for use as therapeutic agent for treatment of cancer, involves irradiating target aqueous suspension with neutron source, where at least some of target nuclide material absorbs neutrons from the neutron source.

LAPKA J, SAMIA A J, NOLTING D D, CHARLTON W S

Composition for forming article e.g. seals, comprises matrix polymer chosen from thermoplastic polymer and curable polymer having functional group for crosslinking, and three-dimensional, branched and/or crosslinked carbon nanostructure additive provided in amount such that after forming article.

REICHL G, GUREVICH E, PERIYASAMY M, QUARTAPELLA C J, PIACENTE N P, LYNN B

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Plasma enhanced chemical vapor deposition method used in semiconductor structure, comprises turning on radio frequency source of radio frequency system to decompose aromatic hydrocarbon precursor into multiple active radicals at specific frequency to form graphene layer on magnetic layer.

WU Z, NI I, XU Y, HUANG J, WU C, HSU Y, HUANG J Z, HSU Y H