国家/地区 中国（29）
IPC部 B（29） H（29） C（11）
D（2） G（2）
IPC大类 B32（29）
IPC小类 B32B（29）
IPC B32B009/04（16） B32B009/00（14） B32B037/10（11）
B32B037/06（10） B32B033/00（9） H05K007/20（9）
H05K009/00（9） B32B015/20（8） B32B037/12（8）
B32B038/00（7） B32B003/08（6） B32B007/12（6）
B32B027/06（6） H05B003/14（6） B32B015/00（5）
发明人 CAI J（2） CHEN M（2） CHEN R（2）
JIN Y（2） LIU J（2） WANG B（2）
WANG J（2） WANG X（2） WANG Z（2）
ZHAO P（2） ZOU Z（2）
公开年 2022（29）
申请年 2022（29）
专利权人

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Double-loss type rubber absorbing material useful in e.g. electronic information technology, comprises rubber, electric loss filler, magnetic loss filler and vulcanizing processing auxiliary agent, where material is prepared by mixing rubber and electrical loss filler to obtain first master batch.

PENG Z, ZHANG J, KONG N, TAO J, LIAO L, WANG R, WANG B, ZHAO P

Fiber composite material used in shell of electronic device, comprises resin-based polyethylene fiber reinforced layer, flexible film sensor layer, and resin-based glass fiber reinforced layer, where flexible film sensor is laminated on resin-based polyethylene fiber reinforced layer.

JIN Y

Preparing composite material used in electromagnetic shielding, involves soaking functional layer film into modified resin matrix, to form functional layer prepreg, laying prepared functional layer pre-soaking material and fibre prepreg layer, forming composite laminated prepreg, hot-pressing prepeg.

WANG B, ZHU J, LI T, CAI J, LI H, SUN H

Elastic heat conductor for communication devices, has elastic core and metal layer stacked in one direction, in contact with each other, denoting elastic heat conductor, and heat conduction layer wrapping elastic core and metal layer of preset thickness, such as gold, silver, copper and aluminium.

ZOU Z, YU Y, CHEN Q, LIU J, CHEN M

Producing resin-based ceramic composite copper clad plate comprises e.g. adding modified hexagonal boron nitride powder into graphene oxide solution, mixing epoxy resin and carboxy-terminated nitrile rubber, coating glue on surface of aluminum plate, and laminating copper foil on glue layer surface.

SONG S

Flexible wave-absorbing fabric used in wearable device, comprises resistive periodic pattern layer, fabric medium layer, reflective layer or conductive layer from top to bottom.

WANG J, YANG Y

Graphene sheet material for use in electronic device element, has insulating layer adhered to protective layer through bonding layer, where graphene layer and insulation layer are formed by precise die cutting and forming and attached.

SONG J, WEN T, DU J, RONG Q, JIA J

Heating floor used for railway vehicle, comprises heating panel with heating function, foaming core layer with heat insulation function, and flame-retardant insulating plate with heat insulating function, where heating panel, foamed core layer and insulating board, circuit are sequentially adhered.

LIU W, LIN S, LIN L, WANG M, CHEN R, ZHOU Z