国家/地区 中国（16）
IPC部 C（16）
IPC大类 C08（16）
IPC小类 C08G（16）
IPC C08L063/00（16）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2） LIU L（2）
公开年 2017（4） 2022（3） 2015（2） 2021（2）
申请年 2016（3）  2021（3）  2014（2）  2017（2） 
专利权人 SAMSUNG ELEC.（2）

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Graphene/liquid crystal epoxy resin high thermal conductivity composite material comprises liquid crystal epoxy resin, liquid crystal functionalized magnetic graphene and curing agent.

WANG Z, ZHANG X, ZHAO Q, ZHANG T, CHEN F

Lignin derivative-based phosphorus-containing epoxy resin used for forming composite material for flame retardant materials, coatings, microelectronic packaging materials, and adhesives, comprises structures.

YANG W, DING H, MA P, XU P

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Preparation of graphene-containing aqueous epoxy resin emulsion for use in anti-corrosion coating, involves adding ethylene glycol, graphene and catalyst, passing high purity nitrogen, slowly adding ethylene oxide and mixing epoxy resin.

LIN L, ZHAO L

High-concentrated graphene/epoxy resin composite material comprises bisphenol A type liquid epoxy resin, graphene micro sheet, bisphenol A and catalyst.

KONG L

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y