国家/地区 中国（9）
IPC部 C（9）
IPC大类 C22（9）
IPC小类 C23C（9） C22C（5） B22F（4）
C22F（4） C21D（2） C23F（2）
H01H（2）
IPC C23C016/26（9）
发明人 MA Y（4） CAO H（2） SHEN H（2）
公开年 2021（5） 2022（3）
申请年 2021（9）
专利权人 ZHEJIANG CHI.（3） SHANGHAI XIN.（2）

Preparing copper rare earth graphene electrical contact material comprises e.g. mixing copper rare earth alloy powder and silicon powder to obtain mixed powder, carrying out chemical vapor deposition, separating silicon powder in mixed powder, sintering, extruding and drawing preform.

CAO H, MA Y

Preparing metal-based graphene composite material, comprises mixing graphene slurry and metal powder to form mixed slurry, and forming mixed slurry into metal-based graphene composite material by chemical vapor deposition in oxygen-free environment.

QIAN T, CAO H, SHEN H, LV X, MA Y

Preparing copper-based graphene useful for preparing copper-based graphene conductor of electric wire cable, comprises performing surface cleaning and drying on copper material, stacking with high temperature resistant substrate, annealing, and growing graphene layer on copper material surface.

FU J, YANG J, SHEN H, ZHANG W, MA Y

Continuous preparation method of three-dimensional in situ graphene reinforced metal base composite material used in aerospace and automobile , involves conveying stacked multi-layer graphene foam metal strip.

SHI P, SHEN Z, LIN Z, ZHONG Y

Preparation method of nitrogen-doped graphene metal material used in metal corrosion protection involves placing raw materials, providing containing cavity and growth cavity, and placing metal growth substrate in growth cavity.

WU Q, MA Y

Preparation of cast-in-situ growth graphene-reinforced copper composite material used in e.g. civil application, involves reducing surface of copper powder, carrying out radio frequency plasma enhanced chemical vapor deposition, smelting sample, continuously stirring, and cooling.

HUANG P, ZHENG Z, WANG F

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

Vertical graphene composite heat conducting copper foil comprises copper foil substrate layer adhered with two plane graphene layers at surface and bottom, where surfaces of plane graphene layers have vertical graphene layers.

ZHANG L, YE Q, WANG X, SHEN L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E