国家/地区 中国（16）
IPC部 C（16）
IPC大类 C09（16） H05（2）
IPC小类 C09J（16）
IPC C09J183/04（16）
发明人 SUN J（2） ZHOU X（2）
公开年 2021（10） 2022（6）
申请年 2021（16）
专利权人 BEIJING XUTA.（2）

Heat-dissipating silica gel comprises silicone rubber, modified graphene powder, modified carbon nanotubes, crosslinking catalyst, curing agent, solvent, and adhesive.

SUN J, XIAO Q

Heat-conducting and insulating graphene gasket comprises carbon fiber provided along thickness direction of graphene block to form graphene-carbon fiber three-dimensional heat-conducting structure, and insulating layer that contains anisotropic magnetic boron nitride.

FANG X, HE X, ZHOU X, DOU L, YANG S, SUN A, CAO Y

Antistatic heat-resistant glue comprises e.g. acrylic resin, acrylonitrilebutadiene-styrene copolymer, silicon dioxide, anti-aging agent, coupling agent, anti-bacterial preservative, absolute ethyl alcohol, crosslinking agent, defoaming agent, graphene sheet, carbon nano tube, and silicon nitride.

ZHAO B, ZHOU Y, ZHAO C, LUO Q, LUO P

Non-hydrogel flexible electronic packaging material used in embedding flexible electronic circuit device, comprises low volatility non-water filling medium, organic silicon copolymer, vinyl silicon oil, modified nano filler and crosslinking agent.

ZHOU R, ZENG J, LUO Y, YE S, CHEN Y, GONG J, HE J

Double-faced adhesive tape structure without base material, has acrylic adhesive layer arranged on side of graphene coating layer on upper and lower sides, and pressure-sensitive adhesive layer is arranged on opposite side of adhesive layers.

ZHOU D

Preparing graphene bottom sealing adhesive comprises e.g. measuring raw materials, adding into reaction furnace, heating, vacuumizing reaction, adjusting to normal pressure, heating reaction to obtain component A, mixing and stirring to use as sealing adhesive.

MA L, SHA X, SHA Y

Adhesive tape used for fixing flexible circuit board comprises release film, first adhesive layer (e.g. tripropylene glycol diacrylate), base material layer (polyethylene terephthalate polyester slice), second adhesive layer (acrylate and maleated rosin), and foam layer (polyethylene particles).

GUO Y

High performance resin-based adhesive used in metal base material comprises bismaleimide resin, polyimide modified epoxy resin, end hydroxy liquid polybutadiene rubber, organosilicone rubber, end isocyanate based polyurethane, amine curing agent, curing accelerator, coupling agent, and filler.

ZHOU X, FENG H

New-type high temperature resistant graphite radiating adhesive tape for use in production process of electronic product, has adhesive tape base layer whose lower part is provided with graphite layer.

ZHANG Z, JIANG S

Condensed two-component organic silicon pouring sealant comprises alpha, omega-dihydroxy polydimethylsiloxane, plasticizer, carbon nanotube fiber, silicon carbide whiskers, zirconia, graphene and boron nitride, crosslinking agent, coupling agent, catalyst, and plasticizer.

ZHENG Y, LIAO J