国家/地区 中国（27）
IPC部 C（27）
IPC大类 C25（27）
IPC小类 C25D（27）
IPC C25D005/54（13） C25D003/38（10） H05K001/09（7）
H05K003/42（7） H05K003/18（6） C25D005/56（5）
H05K007/20（5） C25D007/00（4） C01B032/194（3）
C25D009/04（3） H05K009/00（3） C23C014/18（2）
C25D005/02（2） C25D005/10（2） C25D005/18（2）
发明人 ZHANG J（5） CAO X（4） MA Y（4）
YE G（4） ZHENG K（4） CHEN W（3）
DU W（2） HUANG Y（2） LIU H（2）
LIU Z（2） LU J（2） PAN Z（2）
ZHANG Z（2）
公开年 2021（12） 2023（5） 2019（3） 2022（3）
申请年 2021（8）  2022（6）  2020（5）  2018（3）  2019（2） 
专利权人 CHINESE ACAD.（4） HUANG Y（2） SHANGHAI DIB.（2） SICHUAN JUCH.（2）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Preparation of graphene heat conducting sheet for e.g. reinforcing longitudinal heat flux transmission, involves spraying graphene oxide quantum dots on inner edge surface of prepared annular graphene oxide film, placing in humidity box, compacting and molding, and graphitizing.

KONG X, JIAO Y, ZHANG J, ZHANG Z

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Radiating net for graphene honeycomb, has honeycomb net base material whose surface is sprayed with graphene coating, and is compounded with conductive material layer by hot melt adhesive and honeycomb net base material that is formed by water-plating and pressing of polyurethane sponge.

CHEN W

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q