国家/地区 美国（27）
IPC部 H（27） C（13） B（12）
F（3） G（3）
IPC大类 H05（27）
IPC小类 H05K（22） H01L（10） H05B（8）
C08K（5） B32B（4） C08L（4）
C08G（3） C09D（3） C23C（3）
G06F（3） H01B（3） B01J（2）
B33Y（2） B64D（2） C01B（2）
IPC H05K001/02（7） H05K009/00（7） H05K001/03（5）
H05K003/00（5） H05K007/20（5） H05B003/14（4）
H05K001/18（4） C08K003/04（3） C08K003/34（3）
H05K001/11（3） B32B027/20（2） B64D015/12（2）
C08G063/06（2） C08G063/60（2） C08K003/22（2）
发明人 KIM Y S（3） JIN R（2）
公开年 2021（27）
申请年 2021（27）
专利权人 AT S AUSTRI.（3） AT S AUSTRI.（3） TICONA LLC（3） AT S AUSTRI.（2）

Microelectronic package used for electrical device e.g., handheld or mobile electrical device comprises a die, and package substrate which comprises electrostatic discharge protection material including electrically-conductive carbon allotrope and electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Electromagnetic interference shielding material useful for EMI shielding applications on electronic devices and circuit boards, comprises biopolymer or polymer dissolved in organic solvents, and shielding guest materials comprising particles, powders, tubes or rods, flakes, fiber or sheets.

GROTE J G, SALOUR M M, ZANG D Y

Printing and growing of three-dimensional conducting structure of elementary metal for three-dimensional packaging, involves supplying solution into plasma, and reducing oxidation state of metal by reactive plasma species to form metal.

KOEHNE J E, MEYYAPPAN M, GANDHIRAMAN R

Cooling device for suppressing adhesion of small pieces of graphite sheet to circuit board, has shielding portion that is provided at position between portion of circuit board where no heat-generating component is mounted.

BABA Y

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Apparatus e.g. dual in-line memory module for performing thermal management, has die that is mounted over substrate and has multiple electrical connections in contact with corresponding one of multiple substrate pads.

RICHARDS R K, KINSLEY T H, KING G A, SHARMA Y, PAX G E, YOO C H

Structural component for aircraft, comprises heatable component section having layer structure comprising inner base structure, heating layer having carbon allotropes embedded in matrix material, and first group of consecutive layers.

BONACCURSO E, LINDE P

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Composite resin heating body material for fiber product and intelligent wearing article , comprises carbon material and rest is matrix resin and prepared by weighing amount of carbon material and matrix resin by high speed stirrer melting.

TANG T, SU T, MA D, TONG X, TSANG H L J