国家/地区 中国（21） 世界知识产权组织（5） 韩国（3） 美国（3） 欧洲专利局（EPO）（2） 日本（2）
IPC部 C（23）
IPC大类 C25（23） C23（6） H01（5）
C01（4） C22（4） H05（4）
B32（2）
IPC小类 C25D（23）
IPC C25D003/38（23）
发明人 GUO C（3） LAI H（3） DU Q（2）
LI S（2） WANG J（2） WEI K（2）
WEI W（2） ZHANG J（2） ZHANG L（2）
公开年 2021（14） 2022（6） 2023（3）
申请年 2021（23）
专利权人 GUANGZHOU UL.（2） UNIV CHANGZH.（2）

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B

Preparing graphene reinforced metal/alloy composite material, involves orienting solution containing graphene and metal ions, keeping spreading state of graphene unchanged, and co-depositing graphene and metal or alloy on cathode plate.

HUANG Y, LANG H, PENG Y

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Electro-deposition copper-reducing graphene composite material used for measuring metronidazole used for treating e.g. trichomoniasis, involves dropping graphene dispersion liquid uniformly on bare glass carbon electrode, which is then dried at room temperature to obtain composite material.

PANG C, LI S, MA X

Processing uniform electroplating of inorganic non-metal base material useful in e.g. electronic device, comprises e.g. adding high-conductivity activated plating solution with circulating filtration system, placing substrate on annular cathode fixing frame, and plating.

ZHENG X, JIANG Z, ZHANG L

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q