国家/地区 世界知识产权组织（10）
IPC部 B（10）
IPC大类 B82（4） C23（4） G06（4）
B29（3） B32（3） B41（3）
C09（3） C25（3） H05（3）
B05（2） B33（2） C01（2）
C08（2） G01（2） G12（2）
IPC小类 B82Y（4） C23C（4） G06F（4）
B29C（3） B32B（3） C09D（3）
C25D（3） B05D（2） B33Y（2）
B41J（2） C01B（2） G12B（2）
H05K（2）
IPC B82Y030/00（3） G06F001/16（3） B33Y070/10（2）
B33Y080/00（2） C09D005/00（2） C09D175/04（2）
C25D011/02（2） C25D013/06（2）
发明人 WU K（7） CHANG C H（4） HOLDER H A（2）
LI Y（2）
公开年 2021（4） 2022（2）
申请年 2019（3）  2021（3）  2020（2） 
专利权人 HEWLETTPACKARD DEV CO LP（10）

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Producing coated metal alloy substrate for electronic device by scanning metal alloy substrate to determine three-dimensional surface profile of portion of metal alloy substrate and printing coating layer on metal alloy substrate.

WU K, YEH Y, CHANG C H

Flexible printed article used in wearable device e.g. conductive contact pad, comprises non-conductive, graphene oxide membrane base substrate, and electronic component positioned on non-conductive, graphene oxide membrane base substrate.

IONESCU R C, HOLDER H A, WITTKOPF J A, WORSLEY R, CASIRAGHI C, SHIELDS J P

Cover for electronic device comprises metal cover substrate, transparent passivation layer on top surface of substrate, water-borne graphene coating layer on transparent passivation layer, and electrophoretic deposition coating layer.

WU K, CHANG C H, HSIEH H

Graphene printing apparatus used to print graphene onto substrate, comprises gas source to cause graphene precursor gas to flow across substrate surface and localized heat source to locally heat portions of surface to cause graphene to grow.

IONESCU R, HOLDER H A, GE N, WITTKOPF J

Multi-layered sheet for use as housing for electronic devices, has graphene-based barrier coating that includes specified amount of graphene and is formed on micro-arc oxidized layers and has prescribed thickness.

WU K, CHANG C, CHEN W