国家/地区 中国（28）
IPC部 C（28）
IPC大类 C08（28） D06（7） B32（3）
C09（3） C01（2）
IPC小类 C08J（28）
IPC C08L063/02（28）
发明人 LIANG M（4） QIU B（4） SUN T（4）
ZOU H（4） CHEN Y（3） LIU Y（3）
ZHANG X（3） CHEN C（2） HUANG Y（2）
LI H（2） LI J（2） LI Y（2）
LIU H（2） LIU L（2） WANG F（2）
公开年 2022（12） 2021（8） 2023（3） 2020（2）
申请年 2021（11）  2022（10）  2020（3） 
专利权人 UNIV SICHUAN（4） UNIV QILU TE.（2）

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing nanocellulose/graphene/epoxy resin composite material, comprises e.g. dispersing graphene into aqueous solution of nanocellulose nanocrystals, performing high-speed shear dispersion, adding nanocellulose fiber slurry into it, dispersing, drying, infiltrating it, and curing.

YAO J, LIU H, ZHOU L, WANG F

Preparation of modified carbon fiber used as reinforcing material, involves dipping desized carbon fiber in pyrenebutyric acid polyethylene glycol aqueous solution, soaking in graphene oxide water suspension, and drying.

SUN S, LI H, LIU Y, GUO Z, AO Y, MA J, JIN L

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Covering film for heat conducting and electromagnetic shielding, comprises epoxy resin, composite filler which is modified nano cellulose, modified graphene oxide and carbon black, and auxiliary agent.

LIU Y, WEI C, GU H

Continuous carbon fiber reinforced thermosetting resin prepreg for three-dimensional printing, has carbon fiber bundles, thermoplastic rubber and thermosetting resin arranged, and carbon fiber bundle formed by bonding carbon fiber with binder.

HU Q, LI D, ZHANG H

Method for preparing high-strength antistatic three-dimensional sheet for use in cover plates, involves dissolving evenly coating the glue solution on the surface of the glass fiber cloth pretreated to obtain a prepreg and placing the prepreg to be pressed in a mold, and molding.

HE H, ZHANG Z

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z