国家/地区 中国（21） 韩国（3） 世界知识产权组织（2）
IPC部 C（23）
IPC大类 C09（23） C08（4） B32（3）
H01（2） H05（2）
IPC小类 C09J（23） C09D（4） B32B（3）
C08K（3） C08J（2） C08L（2）
H01M（2）
IPC C09J175/04（23）
发明人 BIN J（3） FANG X（3） HE L（2）
WANG X（2） WANG Y（2） XU C（2）
XU J（2） ZHANG L（2）
公开年 2022（23）
申请年 2022（12）  2021（9）  2020（2） 
专利权人 GUANGDONG GE.（3） XIAMEN BADOU.（2）

Method for improving stab resistance of aramid non-woven fabric, involves modifying aqueous polyurethane adhesive using graphene as modifier, dispersing graphene in water or organic solvent, reacting, and gluing aramid fibers.

ZHANG J, FU L, PAN Z, WU Z, LIU Y, CUI Z, LI Z, FANG X, XU D, HU L, CHEN H, AI Q, LI N, DAI J

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Adhesive useful for automotive lithium batteries, comprises silane modified polyurethane prepolymer, plasticizer, filler, aminated graphene oxide, tackifier, antioxidant and catalyst.

ZHA Y, FU J, WANG P, WANG Y

Thermally conductive adhesive film useful in smart mobile phone, electronic skin, strain sensor, super capacitor and flexible solar cell, comprises film substrate, conductive material, flame retardant and smoke suppressant, binder, and curing agent.

BIN J

Back glue useful for ceramic tile in household decoration, comprises component comprising acrylic acid emulsion, aqueous polyurethane emulsion, thixotropic agent, defoamer, bactericide, and water.

WANG C, ZHANG L, HAN S, FANG X, DONG F, HE S

Thermosetting crosslinked hot-melt adhesive film comprises thermoplastic polyurethane (TPU), composite crosslinking agent, phenolic resin, heat-resistant filler, heat-conducting filler, and light stabilizer.

BIN J

Heat conductive adhesive useful for microelectronic device, comprises epoxy resin, aqueous polyurethane, ethyl acetate, heat-conducting filler, dicyandiamide, vinyl acetate, polyacrylamide, diluent, curing agent, accelerant, toughening agent and defoaming agent.

JI M, LING K, LI C, FAN Y

Low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic potting adhesive comprises polyether polyol, modified polyurethane prepolymer, heat-conducting powder, modified graphene oxide, vinyl silicon oil, fire retardant, anti-foaming agent, dispersing agent, coupling agent.

WANG Y, TANG R

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X

Flexible anti-corrosion belt in abnormal piece surface-corrosion, comprise aliphatic polyurethane resin, anaerobic type unsaturated polyester resin, resin slurry, graphene resin, chopped glass fiber initiator.

XU J, WANG X, HE L, XU C