国家/地区 中国（14） 美国（11） 日本（6） 韩国（6） 台湾（5） 世界知识产权组织（4） 欧洲专利局（EPO）（3）
IPC部 C（21）
IPC大类 H05（21） C08（10） H01（8）
C09（7） B32（5） C25（4）
B29（3） C01（3） B05（2）
B23（2） B28（2） C04（2）
IPC小类 H05K（21） C08L（9） C08K（7）
B32B（5） C09D（4） C25D（4）
H01B（4） H01L（4） C01B（3）
C08G（3） C08J（3） C09K（3）
B05D（2） B23K（2） B28B（2）
IPC H05K003/00（21）
发明人 KIM Y S（2） YANG N（2） YEH A（2）
ZHANG Z（2）
公开年 2021（6） 2022（3） 2023（3） 2017（2）
申请年 2020（5）  2022（4）  2021（3） 
专利权人 SAMSUNG ELEC.（2） TICONA LLC（2） TRIALLIAN CO.（2） YEH A（2）

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Preparing high thermal conductivity resin useful for PCB plug holes, comprises e.g. introducing thermally conductive filler and low dielectric loss resin into preheating machine, carrying out preheating treatment to it by preheating machine; weighing graphene, and passing into mixing drum.

NIE X

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Non-fiber reinforced fluorine-containing resin based high-frequency copper-clad plate comprises copper foils positioned on two sides of a fluorine-containing resin base plate positioned in the middle, which is prepared by using fillers such as silica, alumina, and titanate coupling agent.

XIANG Z

Circuit structure comprises substrate comprising polymer composition comprising electrically conductive filler distributed within polymer matrix, and polymer matrix comprises thermoplastic high performance polymer.

KIM Y S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Ceramic/copper/graphene assembly used as heat radiating member, has structure in which ceramic member, copper member and graphene-containing carbonaceous member are joined, active metal carbide layer, and magnesium solid solution layer.

NOBUYUKI T, TERASAKI N

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R