国家/地区 中国（14）
IPC部 C（14）
IPC大类 C22（14）
IPC小类 C22F（14）
IPC C23C016/26（14）
发明人 WANG X（3） LIU K（2） WANG E（2）
ZHANG W（2）
公开年 2021（4） 2022（3）
申请年 2021（4）  2019（3）  2022（2） 
专利权人 SONGSHAN LAK.（2）

Method for preparing anti-oxidation bonding alloy silver wire containing graphene on surface in microelectronic packaging field, involves using polystyrene as carbon source to grow graphene on surface of copper plating layer to obtain bonded silver wire containing graphene on surface.

LI Y, LI S

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Preparing copper-based graphene composite material comprises growing graphene film on surface of copper foil by chemical vapor deposition, stacking, using ultrasonic welding technology to weld stacked components, and removing stress and annealing welded stack assembly.

WANG E, WANG X, HE M, ZHANG R, ZHAO C, HU X, LIU K, FU Y

Preparing copper-based graphene useful for preparing copper-based graphene conductor of electric wire cable, comprises performing surface cleaning and drying on copper material, stacking with high temperature resistant substrate, annealing, and growing graphene layer on copper material surface.

FU J, YANG J, SHEN H, ZHANG W, MA Y

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

Vertical graphene composite heat conducting copper foil comprises copper foil substrate layer adhered with two plane graphene layers at surface and bottom, where surfaces of plane graphene layers have vertical graphene layers.

ZHANG L, YE Q, WANG X, SHEN L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Manufacturing graphene thin film composite copper base heat sink comprises forming graphene thin film layer, forming metal film layer on graphene thin film layer, and carrying out hot pressing treatment to metal film layer.

RU Z, MA W, LIANG B, SONG H, ZHU Y, SONG S, YIN Z

Preparing interpenetrating graphene-copper composite material involves using atmospheric pressure chemical vapor deposition method, using gaseous or liquid carbon source to grow graphene in situ on copper or copper alloy powder.

LI T

Preparation method for preparing graphene-metal composite material involves stacking graphene-metal composite raw material and sintering graphene-metal composite raw material to produce graphene-metal composite material.

ZHANG J, BAI H, XIONG L, LUO J, CHEN G, JIANG D, HANG C