国家/地区 中国（95） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（97）
IPC大类 C08（97） C09（11） D06（9）
B32（7） C01（5） B82（4）
H01（4） H05（4） B29（3）
IPC小类 C08L（97）
IPC C08L063/02（97）
发明人 CHEN Y（11） ZHANG X（8） LIU Y（6）
ZHANG Y（6） LIANG M（5） QIU B（5）
SUN T（5） ZOU H（5） LI Q（4）
LIU L（4） WANG X（4） ZHANG J（4）
CHEN L（3） GUO Y（3） LI H（3）
公开年 2022（33） 2021（27） 2020（10） 2023（10） 2013（3） 2014（3） 2015（3） 2016（3）
申请年 2021（37）  2022（21）  2020（15）  2023（5）  2013（4）  2014（4）  2016（4）  2019（3） 
专利权人 UNIV SICHUAN（6） HARBIN INST .（2） HARBIN INST .（2） SIXTH ELEMEN.（2）
UNIV CHANGCH.（2） UNIV JIANGNA.（2） UNIV LANZHOU.（2） UNIV NANJING.（2）
UNIV QILU TE.（2） UNIV SHAANXI.（2） WUHAN INST T.（2）

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Thermosetting high temperature resistant conductive shielding material comprises resin matrix, curing agent, coupling agent, functional filler, and organic solvent.

LIN Y, JIANG X, FANG W, CHEN F

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Graphene hybrid composite material used in conductive materials, comprises porous network graphene and epoxy resin perfused and cured in porous network graphene, which is obtained by combining poly-p-phenylene terephthalamide on graphene sheet, freeze-drying and performing carbonization treatment.

YANG F

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

Preparing nanocellulose/graphene/epoxy resin composite material, comprises e.g. dispersing graphene into aqueous solution of nanocellulose nanocrystals, performing high-speed shear dispersion, adding nanocellulose fiber slurry into it, dispersing, drying, infiltrating it, and curing.

YAO J, LIU H, ZHOU L, WANG F

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Modifying carbon fiber supporting epoxy resin used as base material in chemical process device e.g. adding diethylenetriamine, 1-ethyl-carbodiimide hydrochloride and N-hydroxysuccinimide, mixing and stirring organic phase, and adding alkaline solution and reacting.

GUO Z, CHEN L, HE L, LIU D