国家/地区 中国（11）
IPC部 C（11）
IPC大类 C22（11） H01（7） B22（3）
IPC小类 C22C（11）
IPC C22C029/06（11）
发明人 WANG X（11）
公开年 2016（11）
申请年 2015（11）
专利权人 AVIC BEIJING.（11）

Packaging material for electronic devices, comprise graphene oxide, silicon carbide particles and aluminum-silicon alloy powder.

DAI S, WANG X, YANG C, ZHANG X, LI J

Preparation of packaging material for electronics comprises mixing, encapsulation and burning oxidized graphene, silicon carbide and aluminum alloy powder containing silicon, titanium-boron, beryllium and aluminum powder.

WANG S, WANG X, ZHANG X, HUANG L, LI J

Electronic packing material comprises graphene oxide, silicon carbide and aluminum alloy powder comprising Al-40Si alloy powder, prepared by preparing mixed powder, preparing capsule, and physical sintering.

DAI S, WANG X, ZHANG X, YAN S, LI J

Electronic packaging material comprises graphene oxide, silicon carbide and aluminum alloy powder comprising Al-40Si alloy powder and Al-5Ti-B alloy powder.

WANG S, WANG X, WU Y, LUO Z, LI J

Electronic packaging material used for e.g. military electronic equipment, comprises substrate comprising aluminum and aluminum alloy powders, and reinforcement containing graphene oxide and silicon carbide particles.

WANG S, WANG X, WU Y, LI J, TANG X

Electronic packaging material for e.g. military electronic device, has reinforcement structure that is made from graphene oxide and silicon carbide particles, and substrate that is made from aluminum alloy powder.

LU Z, WANG S, WANG X, HUANG L, LI J

Preparation of electronic package material used in e.g. military applications, involves mixing graphene oxide, silicon carbide and aluminum powder, preparing wrap and carrying out physical sintering.

WANG S, WANG X, WU Y, HUANG L, LI J

Preparation of electronic packaging material for e.g. military electronic device, involves using graphene oxide, silicon carbine particles and aluminum alloy powder with aluminum-silicon alloy powder and aluminum-beryllium alloy powder.

WANG S, WANG X, HUANG L, LUO Z, LI J

Electronic packaging material for e.g. military electronic device, has reinforcement structure that is made from graphene oxide and silicon carbide particles, and substrate that is made from aluminum and aluminum alloy powder.

WANG S, WANG X, HUANG L, LUO Z, LI J

Electronic packaging material used for e.g. military electronic equipment, has matrix that comprises aluminum and aluminum alloy powder, and reinforcement composition that contains graphene oxide, silicon carbide particles.

WANG S, WANG X, WU Y, LUO Z, LI J