国家/地区 中国（17）
IPC部 C（17）
IPC大类 C25（17） H05（6） C23（3）
C01（2） C09（2） G01（2）
H01（2）
IPC小类 C25D（17）
IPC C25D005/54（17）
发明人 ZHANG J（5） MA Y（4） CAO X（3）
LU J（3） YE G（3） ZHENG K（3）
MA X（2） WANG Y（2）
公开年 2021（8） 2022（5） 2023（4）
申请年 2021（17）
专利权人 CHINESE ACAD.（3）

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Electroplating method for plating graphene oxide on photoresist surface, involves placing substrate material on anode of electroplating device, soaking substrate material in graphene oxide water solution, and plating substrate material.

XU C, MAO Z, GU D, MA X, LU H, CHEN P

Preparation of ultrathin beta-radiation source for micro-components, involves using polymethyl methacrylate/graphene film and platinum sheet, and depositing beta-radiation source on graphene using solution of e.g. beta-radiation source.

ZHANG J, LI C, WANG X, XU P, FENG H, CHEN Z, YANG Y, WU W, ZHOU C, LUO T

Electro-deposition copper-reducing graphene composite material used for measuring metronidazole used for treating e.g. trichomoniasis, involves dropping graphene dispersion liquid uniformly on bare glass carbon electrode, which is then dried at room temperature to obtain composite material.

PANG C, LI S, MA X

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q