国家/地区 中国（12）
IPC部 C（12）
IPC大类 C25（12） C23（5） C21（2）
IPC小类 C25D（12）
IPC C25D003/12（12）
发明人 WANG Y（3） LI Z（2） LIU J（2）
YANG C（2） YU X（2）
公开年 2022（12）
申请年 2022（8）  2021（4） 
专利权人

Processing high corrosion-resistant stainless steel strip for battery shell, comprises placing stainless steel strip in alkali liquid for ultrasonic cleaning, soaking cleaned stainless steel strip in cleaning solution, heat-treating, naturally cooling, and carrying out surface smoothing treatment.

JIANG X, MAO A, JI Y, DING F, XU W, YU X, YU J, WANG Y, SHAN C, FAN G

Electroplating plastic surface useful for door guard plate of automobile comprises mixing graphene, silicon dioxide sol, epoxy resin, curing agent and water, removing oil, spraying mixed slurry, carrying out chemical plating and electroplating, washing, and drying.

LI J, SUN L

Preparing nickel-graphene super-hydrophobic coating, comprises using metal substrate as cathode and nickel as anode, electroplating in plating solution, vacuum drying, obtaining nickel-graphene super-hydrophobic coating on surface of metal substrate.

YANG C, LI Z, WANG A, XING X, ZHANG R, LIU J, CUI G

Hardening stainless steel surface, involves taking sleeve base body after ultrasonic rolling, carburizing surface to form carburized layer, taking sleeve base body after carburization, and brightening surface to obtain finished product sleeve.

BIAN C

Manufacturing titanium fiber used in e.g. biomedical field, comprises subjecting titanium wire to acid washing, pre-nickel plating, and surface copper plating to obtain copper-plated titanium wire, compounding dried copper-plated titanium wire bundled iron pipe, and spraying modified alumina agent.

OUYANG Q, SHUAI G, WEI S, WU X

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Method for in-situ growth of graphene film on nickel-plated surface of copper metal substrate by laser useful in production, transportation involves pre-coating different solid carbon source on copper-nickel alloy coating, and realizing in-situ growth of graphene film by different types of laser.

CHEN M, QI M, QIANG H, ZHENG X, YE X

Graphene quantum dot composite plating solution for electroplating copper sheet, comprises graphene quantum dots, nickel sulfate, nickel chloride, boric acid, organic additives and water-soluble nonionic surfactant.

CHEN N, LI Y, LI Z, LEI W

Preparation of ultrathin beta-radiation source for micro-components, involves using polymethyl methacrylate/graphene film and platinum sheet, and depositing beta-radiation source on graphene using solution of e.g. beta-radiation source.

ZHANG J, LI C, WANG X, XU P, FENG H, CHEN Z, YANG Y, WU W, ZHOU C, LUO T