国家/地区 中国（11）
IPC部 C（11）
IPC大类 C25（11）
IPC小类 C25D（11）
IPC C25D003/38（11）
发明人 JIANG Y（2） MA Y（2）
公开年 2023（11）
申请年 2022（6）  2021（3）  2023（2） 
专利权人

Device for producing graphene-based copper-based nano copper film on circuit board of electronic product, has drainage component that is provided between solution tank and reaction tank for draining solution in solution tank into reaction tank.

PANG M, XIE B

Preparing self-calibrating wear-resistant temperature and humidity sensing system, comprises e.g. mixing graphene oxide solution with silk protein solution, adding reducing agent, reacting, printing interdigitated electrode pattern, and depositing metal film in electroplating solution.

DING L, WANG Y, PAN Y, JIANG Y

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B

Preparing graphene reinforced metal/alloy composite material, involves orienting solution containing graphene and metal ions, keeping spreading state of graphene unchanged, and co-depositing graphene and metal or alloy on cathode plate.

HUANG Y, LANG H, PENG Y

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Method for forming copper-oxidation graphene laminated composite material for use in radiating field and electronic industry, involves forming copper-oxidation graphene laminated composite material with high thermal conductivity.

ZHAO B, YANG Q, ZHOU L, CAO J, WANG W, LI F, ZHAN K