国家/地区 日本（34）
IPC部 C（34）
IPC大类 C09（34）
IPC小类 H01L（34）
IPC C01B031/02（11） C08K003/04（11） B82Y030/00（10）
H01L023/373（9） B82Y040/00（8） C01B031/04（8）
H05K007/20（8） C01B032/194（6） C09D007/12（6）
C09K005/14（6） C09K011/65（6） B82Y020/00（4）
C01B032/15（4） C01B032/19（4） C08L101/00（4）
发明人 AOKI Y（3） ICHIKAWA I（3） ISAO I（3）
TAKEO Y（3） TEZUKA H（3） YOSHINOBU T（3）
AKSAY I A（2） AKSAY L A（2） CHEN C（2）
CRAIN J M（2） KORKUT S（2） LETTOW J S（2）
PRUD H R K（2） PRUD HOMME R K（2） PRUDHOMME R K（2）
公开年 2021（7） 2022（5） 2012（4） 2013（4） 2014（4） 2015（3） 2009（2） 2016（2）
申请年 2021（6）  2011（5）  2014（5）  2020（4）  2012（3）  2013（3）  2009（2）  2019（2） 
专利权人 AOKI Y（3） LINTEC CORP（3） TOYOTA CHUO .（3） AKSAY I A（2）
COUNCIL SCI .（2） CRAIN J M（2） FUJI POLYMER.（2） KORKUT S（2）
LETTOW J S（2） PRUDHOMME R .（2） SAMSUNG ELEC.（2） UNIV BOARD P.（2）
UNIV PRINCET.（2） VORBECK MATE.（2） WALBECK MATE.（2）

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Producing graphene sensor element used for analyzing gas sample, by forming graphene layer on growth substrate, applying fluoropolymer coating layer, removing substrate, transferring onto substrate, and removing fluoropolymer coating layer.

SHERWOOD G J, NELSON J T, SU Q, BUHLMANN P P J, ZHEN X, KOESTER S J

Composition used for fabricating semiconductor structure on semiconductor device for removing metal-containing layer of pellicle structure, comprises water, oxidizing agent(s), and acid(s).

CHEN C, CHANG C, LEE Y, LIU W D, WINDOW C, LEE W, LU W, LIU W, LI Y, ZHANG Z, CHEN Z

Carbon abrasive used to polish slurry, and manufacture semiconductor device contains carbon nanoparticle, and positively charged polymer, and/or positively charged oligomer disposed on surface of carbon nanoparticle.

TAKAI K, KIM D Y, KIM D