国家/地区 日本（30）
IPC部 C（30）
IPC大类 C08（30）
IPC小类 H05K（30）
IPC C08K003/04（19） C08L101/00（17） H05K007/20（11）
H05K009/00（11） C08K007/06（9） H01L023/373（9）
H05K001/03（8） C01B031/02（7） C08K007/00（7）
B82Y040/00（5） C01B032/19（5） C08K003/34（5）
C08L063/00（5） C08L079/08（5） C09D007/12（5）
发明人 HARA H（5） JI S Y（4） HAM S J（3）
KIM S H（3） TAKAGI S（3） HASEGAWA S（2）
HASEGAWA SHOJI（2） JANG B Z（2） JEAN B（2）
JIN R（2） KAMIYA N（2） KAMIYA NAGISA（2）
KIM Y S（2） LEE K S（2） LIN Y（2）
公开年 2021（10） 2009（6） 2012（3） 2013（3） 2014（3） 2015（3） 2022（2）
申请年 2007（5）  2019（5）  2021（5）  2013（4）  2011（2）  2012（2）  2014（2）  2020（2） 
专利权人 SAMSUNG ELEC.（5） TEIJIN LTD（5） GLOBAL GRAPH.（2） GRAPHENE PLA.（2）
GRAPHENE PLA.（2） NANOTEK INST.（2） TICONA LLC（2）

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Cured product used for multilayer sheet, comprises composition comprising resin or resin precursor, and filler having preset aspect ratio, and has preset thermal conductivity and elastic modulus.

KIGUCHI K, TSUCHIYA H, SHIMADA A

Production of nanomaterial-containing resin composite for e.g. display apparatus, involves preparing component containing nanomaterial, impregnating nanomaterial with molten resin, and forming resin composite and peeling resin composite.

YAKIMOTO K, ARAKI K

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B