国家/地区 中国（9） 美国（2） 世界知识产权组织（2）
IPC部 H（8）
IPC大类 H01（8）
IPC小类 H01L（8）
IPC H01L029/78（5） H01L021/336（4） H01L021/04（2）
H01L021/28（2） H01L029/06（2） H01L029/12（2）
H01L029/16（2）
发明人 JIN Z（3） LIU M（3） LIU X（3）
WANG X（3） ZHU H（3） GUO J（2）
HAN M（2） JI Z（2） LUO Z（2）
MA P（2） SHANG L（2） WANG H（2）
WANG W（2） YIN H（2）
公开年 2012（9）
申请年 2011（5）  2010（3） 
专利权人 INST MICROELECTRONICS CHINESE ACAD SCI（9）

Semiconductor device, has cap layer set on gate stack and sidewall surrounding gate stack and cap layer, and semiconductor layers epitaxially grown on exposed graphene layer, where metal contact layers are formed on semiconductor layers.

YIN H, LUO Z, ZHU H

Graphene oxide doped zinc oxide nanometer thin film manufacturing method, involves absorbing-coating mixed solution on sensitive membrane of device and drying in vacuum to obtain graphene doped zinc oxide nanometer film.

HOU C, HUO Z, LI D, LIU M, LONG S, YAN X, WANG X, ZHANG M, XIE C, ZHOU W

Method for manufacturing semiconductor device, involves forming graphene layer on insulating layer, forming gate structure on graphene layer, and forming doped region in semiconductor substrate.

LUO Z, YIN H, ZHU H

Method for forming graphene-metal Ohmic contact region, involves performing electronic beam evaporation or sputtering process on surface of sample by deposition of metals and peeling off surface of sample and drain of photoresist.

CHEN J, GUO J, JIN Z, MA P, PAN H, PENG S, WANG X

Method for preparing substrate of graphene thin film semiconductor device, involves providing metal catalyst layer with substrate, and forming tape clipping layer and adhesive tape layer on organic colloid layer.

GUO J, JIN Z, MA P, WANG X

FET, has source and drain contact electrodes and graphene trench region that are linked together, where graphene trench region is formed on upper part of insulating substrate.

LIU X, LIU M, HAN M, JI Z, WANG H, SHANG L

FET, has source/drain contact electrode and graphene trench region formed on insulating medium layer, where source contact and drain contact electrodes are respectively connected with graphene trench region.

LIU X, LIU M, HAN M, JI Z, WANG H, SHANG L

Graphene device structure for use in complementary metal oxide semiconductor device, has semiconductor doped region and graphene layer that are formed as drain region and source region of device structure respectively.

LIANG Q, JIN Z, WANG W, ZHONG H, LIU X, ZHU H, YE T

Graphene device manufacturing method, involves obtaining substrate, forming negative type or positive type graphene layer on substrate, forming grid regionon graphene layer, and forming inter-layer on graphene layer.

CHEN D, WANG W, ZHAO C