国家/地区 中国（11）
IPC部 H（8） C（3）
IPC大类 H01（8） C23（2）
IPC小类 H01L（8） C23C（2）
IPC H01L021/336（5） C23C016/01（2） C23C016/26（2）
C23C016/56（2） H01L021/28（2） H01L029/78（2）
发明人 JIN Z（7） SHI J（7） WANG X（7）
ZHANG D（7） WANG S（5） MA P（4）
PENG S（3） ZHU H（2）
公开年 2015（11）
申请年 2014（8）  2015（2） 
专利权人 INST MICROELECTRONICS CHINESE ACAD SCI（11）

Flexible substrate based three-dimensional packaging heat radiation structure, has graphene radiating fin fixed to contact surface of chip package body, and graphite heat abstractor provided with metal carrier chip.

CAO L, GUO X, HOU F, WAN L, SU M, WANG Q, ZHOU Y

Storage device, comprises insulating substrate, lower electrode, lower barrier layer graphene, resistive functional layer and upper electrode, where resistive functional layer is located on lower barrier layer graphene.

LV H, LIU M, LIU Q, SUN H, ZHANG K, BENAGI R, BANERJEE W

Graphene strip structure manufacturing method, involves forming groove on first medium layer substrate, forming catalyst layer on first medium layer substrate, and forming catalyst layer on groove.

SU Y, ZHU H, ZHAO C, GU K

Atomic-level mechanical peeling cleaning of graphene surface used for field effect transistor or electric conduction film by taking target substrate, adhering graphene, soaking in organic solvent, and dissolving graphene surface.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Method for nondestructively transferring graphene from metal surface to surface of target substrate e.g. glass substrate, involves transferring prepared polymethyl methacrylate/graphene composite film to surface of target substrate.

JIN Z, MA P, WANG X, ZHANG D, SHI J

Graphene metal contact removing method, involves coating spin in optical resist layer, forming metal electrode with image in inorganic layer surface, and providing graphene-metal contact area with inorganic layer.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Graphene field effect transistor preparing method, involves providing semiconductor substrate surface with graphene surface, providing spin with organic or inorganic metal protection layer, and providing metal electrode with optical image.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Forming copper metal surface on substrate by using chemical vapor deposition, involves growing graphene on surface of copper foil and copper electrolyte agar gel, glassy carbon sheet, graphite, conductive glass or indium tin oxide.

JIN Z, MA P, WANG X, ZHANG D, SHI J

Graphene FET device manufacturing method, involves depositing passivation protection layer using selective etching of passivation protecting layer above grid medium layer, and depositing metal forming source on drain metal electrode.

JIN Z, MA P, WANG X, ZHANG D, WANG S, SHI J

Method for aligning graphene for top gate FET device, involves coating metal on source electrode and drain electrode, and connecting graphene top gate FET device body with electric conduction channel and source and drain electrodes.

JIN Z, MA P, WANG X, ZHANG D, WANG S, SHI J