国家/地区 台湾（14）
IPC部 C（14）
IPC大类 H05（14）
IPC小类 H05K（11） C08K（7） C08L（7）
B32B（4） H01L（4） C01B（3）
C09K（3） C08G（2） C08J（2）
C23C（2） C25D（2） H01B（2）
H01J（2） H01Q（2） H05B（2）
IPC H05K001/03（5） C08K003/04（4） H05K009/00（4）
C08K003/34（3） C08K007/18（3） B32B015/08（2）
B32B015/14（2） B32B027/04（2） B32B033/00（2）
C08G063/06（2） C08G063/60（2） C08J005/24（2）
C08K003/013（2） C08K003/22（2） C08K003/36（2）
发明人 KIM Y S（3） JIN R（2）
公开年 2021（14）
申请年 2020（7）  2021（6） 
专利权人 TICONA LLC（3）

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Composite material for shielding or absorbing electromagnetic wave in e.g. smart phone, has electromagnetic absorbing material comprising silicon carbide, and conductive material comprising two-dimensional carbon material containing graphite sheet and graphene sheet.

CHU Y S, KE Y, HSIEH C, HSIEH I, HO H, LIU W, ZHU J, XIE Z, XIE Y, HE X, LLKE Y, LLCHU Y S

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Polymer-polymer-positive-temperature-coefficient-material for use in e.g. graphene-filler-component, comprises polymer-matrix, polymer, and/or polymeric-containing material.

ZHOU Z, FU Y, CHEN J, JOE J, HU Y

Circuit structure comprises substrate comprising polymer composition comprising electrically conductive filler distributed within polymer matrix, and polymer matrix comprises thermoplastic high performance polymer.

KIM Y S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y