国家/地区 世界知识产权组织（26）
IPC部 B（26）
IPC大类 C04（26） C01（12） B01（8）
H01（8） C09（7） B22（6）
C08（5） B05（4） B29（4）
B32（4） B33（4） B82（4）
B23（3） B28（2） C23（2）
IPC小类 C04B（26）
IPC B33Y010/00（4） C01B032/182（4） C01B032/194（4）
C04B037/02（4） C04B041/48（4） B01J020/20（3）
B82Y030/00（3） C01B032/21（3） C04B035/64（3）
C04B041/45（3） H01L023/36（3） H01L023/373（3）
B01J020/28（2） B01J020/30（2） B22F001/00（2）
发明人 LI X（2） MA Y（2） NOBUYUKI T（2）
TERASAKI N（2）
公开年 2021（26）
申请年 2020（17）  2021（7）  2019（2） 
专利权人 MITSUBISHI M.（4）

Formation of two-dimensional silicon carbide used as wide band gap semiconducting material in electronic applications, involves preparing solution comprising silicon carbide particles and solvent, ultrasonically processing solution, and centrifuging to extract two-dimensional silicon carbide.

CHABI S

Atomizing core comprises raw material, low melting point glass powder, carbon fiber, graphene, additive selected from aluminum dihydrogen phosphate solution, and binder.

CHEN P

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Composite tool component for drill head, comprises conforming catalyst metal that coats diamond particles and graphene particles with consistent thickness about diamond particles and graphene particles.

KUMAR B P, RIVERA R, ROBERTS T S, IVIE B, JORDAN R, RIVERA R J

Hydrogel material used as bone-filled biomedical material used for manufacturing inorganic non-metallic gel scaffold in e.g. tissue engineering, is assembly of inorganic non-metallic particles with preset size forming hydrogel network having microscopic pores with preset pore diameter.

WANG H, DOU Z, CHEN K, LI X, GONG C, SUN K

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Forming foundry casting element, comprises forming aqueous slurry comprising solid inorganic binder material or its precursor, shaping slurry using pattern, curing shaped slurry, and removing pattern from casting element.

RIMAN R E, BLINN K, LEHMANN R E, BULLING K

Additive manufacturing process for forming component, involves partially coating grains of layer of metallic or ceramic powder with film of additive material, at end of deposition of layer of powder and prior to selective melting process.

MINEA T, WALRAND G, EFFERNELLI A, CRESPI A E