国家/地区 日本（34）
IPC部 C（31） H（28） B（9）
G（2）
IPC大类 H01（27） C01（26） C23（22）
H05（9） B01（6） B82（3）
C30（2）
IPC小类 H01L（27） C01B（26） C23C（22）
H05H（8） B01J（6） H01J（6）
B82Y（3） C30B（2）
IPC C23C016/26（19） C01B032/186（14） H01L021/205（12）
C01B031/02（8） C23C016/02（8） H05H001/46（8）
C01B032/182（7） C23C016/511（7） H01L021/768（7）
C01B031/04（6） C01B032/18（6） H01L021/02（6）
H01L021/28（6） H01L021/3065（6） H01L021/67（6）
发明人 MATSUMOTO T（28） IFUKU R（18） WADA M（8）
KABUKI N（5） TAKASHI M（5） KAGAYA M（4）
RYOTA I（4） SUGIURA M（4） NISHIDE D（3）
UEDA H（3） YAMADA H（3） KASHIWAGI Y（2）
KATO D（2） MASAHITO S（2） MATSUMOTO TAKASHI（2）
公开年 2022（8） 2014（4） 2018（4） 2021（4） 2023（3） 2013（2） 2015（2） 2017（2） 2020（2）
申请年 2022（8）  2020（4）  2014（3）  2015（3）  2018（3）  2019（3）  2021（3）  2013（2）  2016（2） 
专利权人 TOKYO ELECTRON LTD（34）

Plasma processing apparatus such as capacitive coupling type plasma processing device has conductive material that is provided with conductive film formed on second surface not facing plasma processing space of silicon element.

SAKANE R

Film forming method involves loading substrate into processing container, forming interface layer having amorphous structure or microcrystalline structure on substrate by plasma of first mixed gas including carbon-containing gas and forming graphene film on interface layer.

NAKAMURA G, TERADA H, MATSUMOTO T, KABUKI N, WADA M, IFUKU R, NAKAMURA K, KAMURAGI N

Processing substrate involves carrying substrate having silicon-containing film on surface of substrate into processing container, forming adsorption layer, forming silicon oxide layer, and forming graphene film on silicon oxide layer by supplying carbon-containing gas into processing container.

FURUYA H, YAMADA H, IFUKU R, MATSUMOTO T, WADA M, HARUHIKO F A

Film forming method by loading substrate into processing container, forming graphene film on substrate with plasma of process gas comprising carbon-containing gas, forming doped graphene film on substrate and/or graphene film with plasma of process gas comprising dopant gas.

YAMADA H, IFUKU R, MATSUMOTO T, KABUKI N

Substrate processing includes taking substrate into processing vessel, removing oxygen-containing layer on substrate using plasma of gas mixture including hydrogen-containing gas, and forming nucleation layer and graphene film on substrate using plasma of gas mixture including carbon-containing gas.

IFUKU R, MATSUMOTO T, WADA M, KABUKI N

Upper electrode assembly used in plasma processing apparatus, has heat transfer sheet that is mounted between electrode plate and metal plate and having vertically oriented portion with vertically oriented graphene structures.

TSUJIMOTO H, KOBUNE T, LI L, LEE L, KOBUNEDAKAKI

Processing substrate by loading substrate into processing container, forming carbon film on substrate with plasma of mixed gas containing carbon-containing gas while inside of processing container is maintained at pressure, and changing inside of processing container.

WADA M, IFUKU R, MATSUMOTO T, YAMADA H, TAKASHI M

Film formation method involves forming metal film on silicon-containing film of substrate, forming a graphene film on metal film, where metal film is silicided by heating metal film, and continuously performing film forming process.

UEDA H, WADA M, ZHEN

Forming film by carrying substrate having recess into processing container, placing on mounting table provided in processing container, using plasma of mixed gas containing inert gas and carbon-containing gas, while applying high frequency bias, and forming graphene film on substrate.

SUGIURA M, MATSUMOTO T

Substrate processing method for processing substrate, involves performing first plasma processing while holding carried-in substrate in first position, and performing second plasma processing in state where substrate support pin is lowered and substrate is held at second position.

WADA M, KABUKI N, IFUKU R, MATSUMOTO T