国家/地区 中国（12）
IPC部 C（12）
IPC大类 C08（12） C09（12） C01（2）
IPC小类 C08K（12）
IPC C08K009/06（12）
发明人 XIAO J（2）
公开年 2017（12）
申请年 2016（6）  2017（6） 
专利权人 ANHUI ZHONGW.（2）

Preparing graphene-based composite thermal interface material comprises e.g. preparing modified graphene oxide, preparing graphene and composite thermal interface material of epoxy resin, and preparing composite thermal interface material.

ZHANG P, YUAN P, XIAN Y, ZENG J, XIAO J, YANG D

Preparation of highly thermally conductive insulating grease filled with modified graphene microdisk involves preparing cyanide graphene microchip, mixing with coupling agent hydrolysate, mixing with dimethyl silicone oil, and roasting.

JIANG H, LUO Z, LIN Q, LIN H

Functionalized graphene used for preparing polyorganosiloxane comprises active molecule and graphene.

XU Y, LI Y, HODGE S, FERRARI A, LIN Y

Graphene-carbon fiber reinforced nylon complex wear-resistant material useful in lubricating bearing, textile and food, comprises e.g. nylon resin, carbon fiber, graphene-nylon masterbatch, organic lubricants and antioxidant.

CHEN R, DENG K

Preparing graphene modified phenolic resin comprises e.g. dissolving silane coupling agent in an alcoholic water mixture and then stirring, adding mixture to a stirring furnace, heating, mixing at high-speed, adding graphene and stirring.

YAO S, LU H, TANG W, ZHU Q

Preparing graphene heat conducting silicone pad involves taking metal foil, growing single layer graphene film by using chemical vapor deposition method on surface of metal foil to obtain graphene film/metal foil.

YE E, LIN J, HUANG Y, JIAO W, ZHANG X, CHEN W

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Modified graphene-containing thermally conductive masterbatch comprises graphene, modifier and nylon 6.

CUI S, DING P, LI D, LIU J, PAN G, SHI L, SONG N, ZHANG Y

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X

Aluminum nitride-carbon nanowire composite material for LED, contains silicon carbide, aluminum powder, silicon oxide, yttrium oxide, montmorillonite, curing agent, emulsified silicone oil, stearic acid, polyvinyl butyral and graphene.

GUO H, AN D, XIA J, XIAO J, LAI C