国家/地区 中国（21）
IPC部 C（21）
IPC大类 C22（21）
IPC小类 C22F（21）
IPC C22F001/08（13） C22F001/02（9） C22F001/04（5）
C23C016/26（5） C22C001/10（4） C22C009/00（4）
C25D003/38（4） C25D015/00（4） C22C021/00（3）
C23C016/02（3） C25D007/06（3） C25F003/22（3）
B21B001/40（2） B21B003/00（2） B82Y030/00（2）
发明人 CHEN Z（2） DING Z（2） HUANG Z（2）
LI T（2） LIU K（2） WANG E（2）
WANG Z（2） YUE X（2） ZHANG W（2）
ZHANG X（2） ZHANG Z（2）
公开年 2021（8） 2022（4） 2017（2） 2018（2） 2023（2）
申请年 2021（9）  2017（2）  2018（2）  2020（2）  2022（2） 
专利权人 SONGSHAN LAK.（2）

Preparing tellurium-copper alloy material containing rare earth metal comprises e.g. taking pure copper, pure tellurium, copper-rare earth alloy and mix, melt, add pure zinc, copper-phosphorus alloy as deoxidizer, solution treating, aging, and electroplating to form coating.

ZHU Y

Preparing high-strength aluminum alloy plate for sheet metal process, comprises e.g. taking ZL114A as aluminum alloy plate base material, adding modifier, heating, adding refining agent, polishing, placing aluminum alloy plate in electrolyte for anodic oxidation, sealing, and drying.

XU J

Preparing high-quality electronic aluminum foil for use in conductive fields such as lithium-ion battery and capacitor, involves preparing micro-nano graphene sheet by electrolytic method, polishing aluminum foil mirror surface by mirror processing device, and cutting into electronic aluminum foil.

YIN K, WANG Z, CHU M, HU D, ZHENG L, CHEN Z, ZHENG G, ZONG Y, HE X

Processing aluminum alloy surface involves grinding aluminum alloy, cleaning and drying, using femtosecond laser multifilament to ablate the surface of aluminum alloy and preparing a graphene coating on the aluminum alloy surface.

SU Y, ZHANG X

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W

Preparation of high temperature resistant copper wire includes calcining magnesium, chromium, titanium, nickel and copper to obtain metal mixture, casting metal mixture into ingot, forging ingot to strip copper core and spraying electroplated copper wire with high-temperature resistant coating.

QIAN G, XU H, SUN F, LAI S

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing graphene high-temperature heating aluminum plate comprises e.g. preparing graphene ink, printing graphene ink on the substrate aluminum plate, performing annealing and encapsulating the graphene surface using insulating material.

WANG Z, LI T, YIN J

Processing tinned copper-clad alloy wire involves preparing alloy rod, welding copper and alloy wire to form copper-clad alloy wire blank, carrying out multiple times of small deformation drawing processing, and plating tin layer.

OUYANG Y